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Description

The V1163 is a high-performance heterogeneous computing XMC module featuring high-bandwidth I/O, based on the AMD Xilinx® Versal™ Adaptive Compute Acceleration Platform (ACAP) and rugged optical and electrical interfaces. It supports configurations based on either Versal Prime or Versal AI Core devices.

Within a single mezzanine card, the V1163 integrates 100G optical interfaces, FPGA fabric, ARM processor cores, and optional AI Engines. It is designed for applications requiring any combination of high-speed optical/electrical connectivity, FPGA processing resources, ARM compute capability, or AI acceleration. Typical use cases include sensor interface development, digital signal processing, video processing, application co-processing, and multi-level secure networking. Systems for radar, SIGINT, video, data storage, medical imaging, and embedded communications can all benefit from the V1163 module.

The V1163 offers electrical and optical I/O options supporting high-speed serial links from 1 to 25 Gbps per lane, with up to 300 Gbps aggregate throughput. By leveraging Versal hardened Ethernet interfaces, PCIe controllers, DMA engines, and associated Xilinx® software drivers, the module enables a mature ecosystem for high-bandwidth Ethernet performance. In addition, the FPGA fabric within the ACAP device can host New Wave DV IP cores for Fibre Channel, ARINC-818, sFPDP, Aurora, and more—making the V1163 an ideal platform for mixed-protocol environments or protocol-bridging applications.

Its compact XMC form factor and rugged construction allow the V1163 to transform a VPX-based single-board computer into a single-slot sensor interface and heterogeneous computing solution. When paired with an x86 SBC, the V1163 delivers 100G optical interfaces, FPGA fabric, ARM cores, and AI Engines within one slot. The V1163 is also available from New Wave DV in a 3U VPX form factor as an alternative to the XMC version.

Specifications

NETWORK INTERFACE
Up to twelve (12) 1G to 25G optical ports (front & backplane options)
• 850nm multi-mode optics
Up to eight (8) 1G to 25G electrical ports to Pn6 (high-speed mezzanine connectore)
SUPPORTED PROTOCOLS
Ethernet, Fibre Channel, sFPDP, ARINC 818, Aurora
ASoC (FPGA) DEVICE
AMD Xilinx® Versal™ VC1902, VM1802, VM1502
MEMORY
2 banks of 4GB up to 1866MHz LPDDR4 SDRAM
HOST INTERFACE
PCI Express Gen4/Gen3 x8/x16
THERMAL SENSORS
2 digital temperature sensors
COMPLIANCE
VITA 20, 42.3, 47, 61.0, 66.5, 88
PHYSICAL CHARACTERISTICS
Dimensions: 74 mm (width) x 143.75 mm (length)
Weight: 0.276 lbs
POWER CHARACTERISTICS
Power Draw: Maximum 45W
Power Supply: 5V to 12V
TEMPERATURE
Operating: -40˚ C to 55˚ C at 250 LFM (air-cooled)
Operating: -40˚ C to 85˚ C (conduction-cooled)
Storage: -55˚ C to 105˚ C

Resources & documentation

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