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Description

As processing performance continues to advance, ECRIN Systems remains committed to optimizing the SWaP-C envelope (Size, Weight, Power & Cost) of its OPALE V2 series.

Designed to deliver high-end computing performance within a 2U chassis less than 20 inches (492 mm) deep, the OPALE V2 Compact fits seamlessly into most 19-inch rack installations.

It is the ideal solution when space constraints, performance, reliability, and long-term availability are critical — whether for military base stations, rugged servers for harsh environments, simulators, telemetry or telecommunications systems, medical imaging, infotainment, control/command stations, test benches, or IoT gateways.

With its in-house design center, ECRIN Systems supports you in the full customization of your system, giving you a competitive edge in the industrial market.

Even for small production runs, we handle the entire system development process and ensure long-term product availability, allowing you to focus on your core business and added value.

From mechanical parts to industrial design, including user interfaces, customizable I/O and connectors (front and rear), front panel color and styling, and personalized Lexan overlays with your logo and branding, we create a unique design that enhances your brand image and supports your sales success.

To streamline your operations, direct delivery is also available for faster and easier deployment to your end customers.

Specifications

RACK SPECIFICATIONS
-
Construction
Anti-corrosion and long term heavy-duty steel
Dimensions (W x H x D)
19’’ / 2U with 19.4 inch depth (483x88x492mm)
Weight
19’’ / 2U with 19.4 inch depth (483x88x492mm)
Color
Black
Cooling
Three 80mm ball bearing low noise fans with monitoring
Top access for easy maintenance, cover removed
Power supply
2U form factor, compliant with Mini Redundant PSU
Drive bays
One 5.25’’ front accessible drive bay or Slim CD + 3.5’’drive bay
One 3.5’’ front accessible drive bay
Backplane configuration
5 slots, 2U butterfly form factor backplane. Full length board on every slot
Front panel
Front door for drive bays and USB access
Embedded MMI, 4 LEDs with I/O capabilities
Lexan for easy customization
Cards lock
Retaining bracket for cards
Rugged front holding parts for full length boards (SHB & I/O cards)
Packaging (W x H x D)
580x260x680mm
SHB SPECIFICATIONS
-
Form factor
PICMG 1.3 – Graphic Class / Server Class - PCI Express Gen 3
Processor
LGA1151 socket - 6th Gen Intel® Core™ processor (codename Skylake)
Chipset
Intel® Q170 Express chipset supporting PCI Express 3.0
Memory
Dual-channel DDR4-2133 up to 32 GB (2* DIMM)
Video
Integrated Intel® HD Graphics (VGA and DVI-D internal)
BIOS
AMI® UEFI BIOS; 128 Mbit SPI Flash Memory
Disk
4x SATA 6Gb/s ports
Intel® Rapid Storage Technology, supports RAID 0/1/5/10
Audio Codec
High definition audio interface with DB-Audio2 (option)
USB
8x USB 3.0, 4x USB 2.0 (on backplane)
Watchdog timer
24~65535 sec software programmable, can generate system reset
Hardware monitor
CPU & System temperature, fan speed and onboard DC voltages
Ethernet
2 x GbE (Intel® I219LM + Intel® I211-AT)
Intel® AMT and Wake On LAN support
Manageability
SEMA support with BMC, SEMA cloud
SSI Trusted boot
1x box header for TPM module (optional) - Atmel AT97SC3204 TIS 1.2
I/O peripherals
Serial port : 2x RS-232, 2x RS-232/422/485
Parallel port : 1x LPT port via onboard box header
KB/MS : 1x internal pin header for PS/2 keyboard/mouse
BACKPLANE SPECIFICATIONS
-
EBP-D5E2
1xSHB / 1xPCIe x16 Gen3 / 1xPCIe x4 Gen3 / 2xPCI
4x USB 2.0
CI00192-A
1x SHB / 2xPCIe x8 Gen3 / 1xPCIe x4 - 2x SATA, 2x USB 2.0
CI00192-B
1x SHB / 1xPCIe x8 Gen3 / 3xPCIe x4 - 2x SATA, 2x USB 2.0
BPC8219
1xSHB / 3xPCIe x16 Gen3 / 1xPCIe x4 Gen3
4x USB 2.0
ENVIRONMENTAL SPECIFICATIONS
-
Temperature
Operating: 0~50°C (MIL STD 810 G, method 502.5 / 501.5) - Storage: -20~80°C
Humidity
Operating: 5% to 90% non condensing
Altitude
0-3000m (0-10.000ft) operating
Shock & vibration
Operating: 15G, 11ms 6 axis (MIL STD 810 G, method. 516.6) - 5~100 Hz 0.8G (MIL STD 810 G, method. 514.5)
CE certification
EMC: 2014/30/UE ; EN 61000-6-2, EN55032, EN 55024 - SAFETY: 2014/35/UE ; EN60950-1 : 2006 2nd edition A11 : 2009 + A1 : 2010 + A12 : 2011 + A2 : 2014
SYSTEM MONITORING AND MANAGEMENT
> Intel® AMT for remote management
> Local control with embedded MMI (Windows & Linux services) :
- FAN control & monitoring
- System & network information
- Watchdog & elapsed time counter
- Redundant P/S default
- Alarm (fan, temperature, redondant P/S), Log file
- User script launch form menu entry
- Easy configuration with .TXT file
OEM SERVICES
> Branding user’s Lexan – Costless, NRE fees only
> Modified COTS customization:
- Front panel design
- Specific I/O on front panel / special connectors on rear panel
- Specific H/W configurations
- Specific S/W functionality
STANDARD CONFIGURATION
-
Power Supply Unit
ATX 12V – 400W – High Efficiency 80+
90 ~ 240 VAC full range / 47~63 Hz
5V@22A, 12V@32A, -12V@0.8A, 3.3V@22A, 5Vstb@3.5A
Option for 2x 420W mini-Redundant 2U P/S
High Efficiency (80+), 90-240VAC auto range /47-63Hz
Back plane
EBP-D5E2 in standard configuration
Drives
1 x Slim DVDRW
1 x 2.5’’ SATA Removable Drive
1 x 3.5’’ front accessible drive bay free
Front I/O (behind door)
2 x USB 2.0
Rear I/O
VGA + 2xGbE + 4xUSB 3.0 + 2xCOM
OPTIONS
-
Processor
- Intel® Core™ i7-6700 (4C/8T, 3.4 GHz, 8M Cache, 14nm, 65W TDP)
- Intel® Core™ i7-6700TE (4C/8T, 2.4 GHz 8M Cache, 14nm, 35W TDP)
- Intel® Core™ i5-6500 (4C/4T, 3.2 GHz, 6M Cache, 14nm, 65W TDP)
- Intel® Core™ i5-6500TE (4C/4T, 2.3 GHz, 6M Cache, 14nm, 35W TDP)
-Intel® Core™ i3-6100 (2C/4T, 3.7 GHz, 3M Cache, 14nm, 51W TDP)
- Intel® Core™ i3-6100TE (2C/4T, 2.7 GHz, 4M Cache, 14nm, 35W TDP)
Memory
DDR4-2133 : 4Go / 8Go / 16Go / 32Go
Disk
- 2.5” 7200 RPM Hard Drive (500Go ~ 1To)
- SLC and/or MLC Solid State Drive (32 Go ~ 2To)
- Up to 4x hot swap 2.5’’ HD/SSD with optional 4in1 drive bay
OS
Microsoft® Windows® 7 32/64-bit, Windows 8.1 & 10 64-bit - Linux 32/64-bit

Resources & documentation

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