OPALE V2: Trusted and reliable embedded industrial PC

Ready for OEM with modified COTS services. See specifications

OPALE V2 Embedded PC

Ref. OPALE V2

Modified COTS with easy brand naming, configuration and customization for
competition advantage
Security with Trusted boot
Local and remote active management to detect errors before they occur
Enhanced asset protection for continuous operation:
- Durable connectors: 15 microinch Gold/Metal plated connectors assure long term
reliability
- Enhanced USB compatibility: USB power supply ensures stability (5V +/-5%)
- Rugged EMI construction: EN55032 Class B radiation test, -10dB than competition Class A
MIL-STD tests passed (for T°C, shocks & vibrations, humidity, noise)
Reduced TCO with reporting Log file and downtime in harsh environments
Green power / Low noise at 37dBA (equivalent to no risk)
Long life management: up to 7 years with revision control
Advanced Multi-Core “Raptor Lake” boosted computing performance with DDR5 speeds
and timings
Flexible backplane options for PCIe configuration with dedicated bandwidth
to accommodate GPGPU/FPGA intensive computing
Up to 14 full length cards / 451 mm depth only

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Need help?

info@ecrin.com

Description

When generic doesn’t fit, multi-Core OPALE V2 family, based on standard PICMG 1.3 form factor, offers flexibility to fit into many applications for OEM,
System Integrators and Application Providers in a variety of domains:

test bench systems,
FPGA/GPGPU intensive computing,
rugged servers for harsh environments (Aero/Mil),
high availability embedded computers for cybersecurity, vision, central data acquisition, control/command…

To precisely meet your requirements, even for small quantities, ECRIN Systems takes full system development responsibility and guarantee long term availability to allow you to concentrate on your added value and core business.

From mechanical parts to industrial design, with front and remote user interfaces, user’s LED’s and I/O’s, easy customized front and rear connectors fitting your activity, specific face-plate color and design, Lexan polycarbonate sheet with your logo and brand name, we will offer you a unique look that will shape your image and promote your sales.

Specifications

RACK SPECIFICATIONS

Construction

Anti-corrosion and long term heavy-duty steel, black color

Dimensions (W x H x D)

19’’/ 4U with 17.8 inch depth (483x177x451 mm)

Weight

18 kg (standard configuration)

Cooling

Three 92mm ball bearing low noise fans with monitoring
Front access for easy maintenance

Power supply

PS2 form factor, compliant with Mini Redundant PSU

Drive bays

Two 5’’1/4 front accessible drive bays

Backplane configuration

14 slots backplane, all for full length I/O boards

Front panel

Front door with lock, two USB and drive bay access
Front door for dust filter and fan maintenance
Embedded MMI, 4 LEDs with I/O capabilities
Lexan for easy customization

Cards lock

Adjustable hold down bar for cards - Rugged holding parts for full length CPU and I/O cards

Carton size (W x H x D)

600 mm x 345 mm x 640 mm

SHB SPECIFICATIONS

Form factor

PICMG 1.3 – Graphic Class / Server Class - PCI Express Gen 3

Processor

14/13/12th Gen Intel® Core™ i9/i7/i5/i3 Processor

Chipset

Intel® Q670E Express Chipset

Memory

Dual-channel Non-ECC DDR5 4800 MHz, up to 64 GB

Video

Integrated Intel® HD Graphics series
1x HDMI on rear I/O, DVI-D and VGA via on board pin header

Ethernet

LAN1: Intel® I226-V via RJ45 - LAN2: Intel® I226-LM via RJ45

Disk

6x SATA 3.0 onboard with RAID support - 1x M.2 M-Key, 2280, support PCIe Gen 4 x 4

Audio

Option via module DB-Audio2 (Realtek® ALC262)

USB

3x USB 3.2 Gen 2 x1 ports (10Gbps) on rear I/O
6x USB 3.2 Gen 1 x1 via onboard box headers
1x USB 3.2 Gen 1 x1 vertical type A port
4x USB 2.0 to backplane

Watchdog timer

1~65535 sec software programmable, can generate system reset

Hardware monitor

CPU/System temperature, CPU fan speed and onboard DC voltages

TPM

Infineon TPM SLB 9670XQ2.0 or 9670VQ2.0

I/O

Serial port (pin header): 2x RS-232/422/485 + 2x RS-232
DIO (pin header): 8-bit in and 8-bit out - Parallel port (pin header) : 1x LPT port

ENVIRONMENTAL SPECIFICATIONS

Temperature

Operating : 0~50°C / Storage -20~80°C

Humidity

Operating : 5 à 90% non condensing

Altitude

0-3000m (0-10.000ft) operating

Shock & vibration

Operating: 15G, 11ms 6 axis (MIL STD 810 F, method. 516.5) - 5~100 Hz 0.8G (MIL STD 810 F, method. 514.5)

Noise

37 dBA (MIL-STD-740-1)

CE Certification

EMC : NF EN IEC 61000-3-2 :2019/A1 :2021/A2 :2024, NF EN 61000-3-3 :2014/A1 :2019/A2 :2021, NF EN IEC 61000-6-4 : 2019, NF EN 55032 :2015/A1 :2020,
NF EN IEC 61000-6-2 :2019, NF EN 55035 : 2017/A11 : 2020. SAFETY : NF EN IEC 62368-1: 2024 / A11 :2024

SYSTEM MONITORING AND MANAGEMENT

System Monitoring & Management

• Intel® AMT for remote management
• Local control with embedded HMI (Windows & Linux services)
- FAN control & monitoring
- System & network information
- Watchdog & elapsed time counter
- Redundant P/S default
- Alarm (fan, temperature, redundant P/S), Log file
- User script launch form menu entry
- Easy configuration with .TXT file

OEM SERVICES

OEM Services

• Branding user’s Lexan – Costless, NRE fees only
• Modified COTS customization:
- Front panel design
- Specific I/O on front panel / special connectors on rear panel
- Specific H/W configurations
- Specific S/W functionality

STANDARD CONFIGURATION

Power Supply Unit

ATX 12V – 400W – High Efficiency 80+
90 ~ 240 VAC full range / 47~63 Hz
5V@20A, 12V@30A, -12V@0.8A, 3.3V@20A, 5VSB@3.5A
Option for 2x 500W Redundant P/S, 80 Plus Gold
90-264Vac full range / 47-63Hz

Backplane

EBP-13E4

Drives

1 x 2”1/2 SATA Removable Drive Enclosure
1 x 5”1/4 front accessible drive bay free
1 x Slim CD drive bay free

Front I/O (behind door)

2x USB 2.0

Rear I/O

HDMI + 2x 2.5GbE + 5xUSB 3.2 + 2xCOM

Processor

- Core™ i9-14901E (8P+0E Cores, 2.8~5.6GHz, 36MB Cache, 65W TDP)
- Core™ i7-14701E (8P+0E Cores, 2.6~5.4GHz., 33MB Cache, 65W TDP)
- Core™ i5-14501E (6P+0E Cores, 3.3~5.2GHz, 24MB Cache, 65W TDP)
- Core™ i9-13900E (8P+16E Cores, 5.2GHz max., 36MB Cache, 65W TDP)
- Core™ i7-13700E (8P+6E Cores, 5.1GHz max., 30MB Cache, 65W TDP)
- Core™ i5-13500E (6P+8E Cores, 4.6GHz max., 24MB Cache, 65W TDP)

Memory

DDR5-4800 : 8GB / 16GB / 32GG / 64GB

Disk

- 2”1/2 7200 RPM Hard Drive (1TB ~ 4TB)
- SLC & 3D TLC Solid State Drive (32 Go ~ 8TB)
- Up to 6x hot swap 2”1/2 HDD/SSD with optional drive bay

- Microsoft® Windows 11 64-bit
- Linux (Kernel 5.8 and up)

BACKPLANE SPECIFICATIONS

EBP-13E4

1xSHB / 1xPCIe x16 / 3xPCIe x4 / 7xPCI

EBP-13E2

1xSHB / 1xPCIe x16 / 3xPCIe x4 / 10xPCI

EBP-10E5

1xSHB / 1xPCIe x16 / 4xPCIe x1 / 4xPCI