3U VPX computing for embedded AI
The Condor AGX-ORIN64-HPC is part of the EIZO Rugged Solutions portfolio offered by ECRIN Systems for embedded platforms requiring combined CPU/GPU computing, AI acceleration and high-bandwidth data transfer.
The board is based on the NVIDIA Jetson AGX Orin 64GB Industrial SoM, combining a 12-core Arm Cortex-A78AE 64-bit CPU with an NVIDIA Ampere GPU featuring 2048 CUDA Cores and 64 Tensor Cores.
Its 64 GB LPDDR5 memory is shared across the CPU, GPU and accelerator engines, providing up to 205 GB/s of memory bandwidth.
These resources support AI inference, deep learning and compute-intensive edge workloads. For additional background on embedded GPU technologies, see the ECRIN Systems guide on GPU selection for rugged PCs, servers and embedded computers.
ConnectX-7, 100GbE and GPUDirect RDMA
The Condor AGX-ORIN64-HPC integrates an NVIDIA ConnectX-7 SmartNIC with:
- 1 × 100GbE Data Plane;
- 1 × 25GbE Data Plane;
- 1 × 25GbE Control Plane.
Combined with NVIDIA GPUDirect RDMA over Converged Ethernet, this networking capability supports high-bandwidth data transfers between distributed devices and processing resources.
This is particularly relevant to Information & Communication Systems where embedded computing platforms need to combine local processing with high-speed data exchange.
AI accelerators, video processing and NVMe storage
The Jetson AGX Orin Industrial SoM includes two NVDLA v2 deep-learning accelerators.
Hardware video engines provide NVENC encoding up to 2 × 4K60 and NVDEC decoding up to 3 × 4K60 or 1 × 8K30 according to the published specifications.
The board includes 64 GB eMMC 5.1 flash storage and supports NVMe storage up to 1 TB over PCIe Gen4.
DisplayPort and USB front-panel interfaces are available depending on configuration, while UART links provide communication with the Orin module and IPMI controller.
Rugged 3U VPX integration
The Condor AGX-ORIN64-HPC is a conduction-cooled 3U VPX board using a 1-inch pitch. It supports SOSA® slot profile SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11-0 and is designed for VITA 46/65 systems.
Published environmental specifications include an operating temperature from -40°C to +85°C, 40 g shock, 0.1 g²/Hz vibration and 95% non-condensing humidity.
These capabilities address compute-intensive Defense, Aerospace & Security applications, including C5ISR, autonomous systems and AI-at-the-edge processing.
From a 3U VPX SBC to a complete embedded system
A high-performance AI SBC is typically one element of a broader VPX platform combining backplane, power supply, thermal management, networking, FPGA and acquisition boards.
ECRIN Systems can integrate this technology within its COTS and Modified COTS approach.
Project management, production and system integration and obsolescence management can also be included according to program requirements.
