Whislist (0)

Description

The ADLINK cPCI-A3MXM is a 3U CompactPCI Serial carrier board designed to host an NVIDIA MXM graphics module, intended for demanding computing and graphics applications.
Built for harsh environments, it operates over a -40 °C to +70 °C temperature range and complies with the EN50155 railway standard.

Specifications

Interface
PCIE
1x PCIe Gen 4.0 x 8 from P1 & P2 (with Gen 3.0 connector now)
MXM
Type A (MXM-A1000) & Type B (MXM-A4500)
Support Max 120W
Support PCIe Gen 4.0 x 8
Front Panel
4 Display port to rear P3 & P5
Form Factor
4x Display Port 1.4, support 4K (3840x2160) resolution
With MXM-A1000
3U 4HP CPCI-S.0 R2.0 standard with locking handle and two front panel securing screws

With MXM A4500 80W
3U 8HP CPCI-S.0 R2.0 standard with locking handle and two front panel securing screws with BTB power board
MTBF & Reliability
MTBF
15.1 Years at minimum
Power
Power Consumption
cPCI-A3MXM/A1000 sku Max. 60W
cPCI-A3MXM/A4500 sku Max. 75W
Power board
1. As DB for more power with 8HP for MXM-A4500 configuration for heat sink version, 12V input from P1.
Mechanical
Material
Front panel: Material: AL6063 T5. Sandblast #150. Anodizing Finish of sides & inside: chromate
Heatsink: aluminum and copper
Material compliant to UNIFE 2020-10-14 Railway Industry Substance List
The front panel screws shall be Torx type or cross type
PCB Coating
Option PCBs conformal coated both sides – type HumiSeal 1B73 Coating (AR) Acrylic.
Dimensions
With MXM-A1000
3U 1-slot 4HP 100 mm x 160 mm (L x W) x 20.32 mm (air cooling type)

With MXM-A4500 3U 1-slot 8HP 100 mm x 160 mm (L x W) x 40.64 mm (air cooling type)
Net Weight
4HP: 0.6 kg, 8HP: 0.7 kg (including heatsink)
OS
Operating system
Windows 10
UBUNTU 22.X
Environment & Certification
Operating Temperature
With Heat sink
version ˙4HP: -40°C ~70°C with airflow, supports display out only.
˙8HP: -40°C ~ 70°C, EN50155 OT3 Class +ST1 (+85C for 10mins) when provided with airflow (for heat sink solution)
˙GPU card will be screen out by ETT. Without heater support
Storage Temperature
-40°C ~ 95°C
Humidity operating
5% to 95% relative humidity (non-condensing)
Humidity storage
5% to 95% relative humidity (non-condensing)
EMC (EMI+EMS)
EN50155 2021

EMC:
˙EN50121-3-2 (radiated and conducted emission + immunity)
˙ EN61000-6-4 / 6-2 (Cover: EN55032 / EN55035 Class A)
˙M edical electrical standards component level IEC 60601-02 (EMC) and IEC 60601-01 (safety)
˙ESD: 8KV by contact,
15KV by air
˙UKCA = CE
˙FCC Part 15B CLASS A
Environment & Certification
Environmental
RoHS 2.0 & REACH
For Rail
˙Shock: EN 50155 2021 cat 1 class b
˙A ltitude: -300M to ~ 4000M
Safety
Fire Protection
Compliant to EN45545-2:2013+A1:2015 (HL 1-3) EL9 for PCB (R24 / R25)
Rolling stock
Compliant to BS EN 50155:2021
CE
Supported

Resources & documentation

Looking for information about cPCI-A3MXM board?

Looking for information about cPCI-A3MXM board?

Do you have a technical question or would you like a quote? Our team is here to help.
Please feel free to contact us using this form.

Other products you may be interested in

See the range
ACPS3310

ACPS3310

The ACPS3310 is a 3U CompactPCI Serial carrier card designed for Acromag’s AcroPack mezzanine modules. It provides two isolated I/O expansion slots that connect AcroPack or mini-PCIe modules to the PCIe bus.
MXC960 CompactPCI Serial PCIe 4.0 & Gigabit Ethernet Switch

MXC960 CompactPCI Serial PCIe 4.0 & Gigabit Ethernet Switch

MXC960 CompactPCI Serial PCI Express and Ethernet switch is a powerful building block for CompactPCI Serial systems
cPCI-A3535 - 3U CompactPCI Serial Intel® Xeon® W Processor board

cPCI-A3535 - 3U CompactPCI Serial Intel® Xeon® W Processor board

The ADLINK cPCI-A3535 is a 3U CompactPCI Serial board powered by the Intel® Xeon® W-11555MRE processor, designed for mission-critical and embedded applications.