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Description

The V6068 is a next generation heterogeneous embedded computing 3U VPX module featuring the AMD/Xilinx® Versal® Premium Adaptive System-on-Chip (ASoC), rugged optical and electrical high-speed I/O, FMC+ site, and SOSA® aligned profile options. The V6068 provides options for Versal® Premium VP1502/VP1702 part selection. In a single 3U VPX card, the V6068 provides three 100G optical interfaces (300G aggregate), large FPGA fabric, ARM processor cores, and FMC+ site.

The V6068 excels at high-bandwidth interface applications where data is processed or pre-processed locally and then distributed across the VPX backplane or optical interfaces. Use cases include sensor interface, data processing, data distribution, and FPGA co-processing applications. Radar, signals intelligence, electronic warfare, video, storage, medical imaging, and embedded communications systems all can benefit from the V6068 module.


By leveraging the Versal® hard silicon Ethernet interfaces, PCIe controllers, DMA engines, and associated software drivers AMD has enabled a robust ecosystem for high-bandwidth Ethernet performance. In addition to the Ethernet interface, the FPGA fabric provided within the ASoC part is capable of hosting New Wave DV IP cores for Fibre Channel, ARINC-818, sFPDP, Aurora, and others. This makes the V6068 an ideal hardware platform for mixed interface protocol needs or protocol bridging applications.


The V6068 serves as a standalone data interface and processing solution in a single 3U VPX module. The V6068 provides twelve (12) full duplex optical ports supporting from 1-25G per lane, FPGA fabric resources, ARM processor cores, and FMC+ site. The V6068 can also be used adjacent to CPU’s and/or GPUs in a 3U VPX system. In this arrangement, the adjacent CPU’s/GPUs are unburdened of the data interface overhead and can be dedicated to running high value applications and algorithms with the V6068 feeding them data directly across the backplane.


The inclusion of an FMC+ site enables customization and flexibility to meet specific application requirements, such as RF capability. Further, this configuration supports scalability and future FMC+ module upgrades to increase performance or add new functionalities long into the product's life.

Specifications

NETWORK INTERFACE
Up to twelve (12) 1G to 25G optical ports (front & backplane options)
- 850nm multi-mode optics
22 lanes of electrical high-speed network I/O available to the backplane
OPTIONAL ADDITONAL PROTOCOLS
Ethernet, Fibre Channel, sFPDP, ARINC 818, Aurora
ASoC (FPGA)DEVICE
Xilinx® Versal® VP1502/VP1702
Contact New Wave Design for additional device support!
MEMORY
2 banks of 16GB (32GB total) up to 1866MHz/3733 Mbps LPDDR4 SDRAM
THERMAL SENSORS
2 digital temperature sensors
COMPLIANCE
VITA 57, VITA 47, VITA 48.2, VITA 65, VITA 66.5
PHYSICAL CHARACTERISTICS
Dimensions
170.75mm length: Face of carrier to back edge of Guide pin connectors
189.22mm length: MPO flip door to back edge of Guide pin connectors 100mm
width: Edge of guide rail to guide rail
24.64mm height: From primary cover to secondary cover
Weight
<1.764 lbs (800g)
POWER CHARACTERISTICS
Power Draw (Max)
216W
Power Supply
12V
TEMPERATURE
Operating
-40˚ C to 85˚ C (conduction-cooled)
Storage
-55˚ C to 105˚ C

Resources & documentation

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