High-speed mixed-signal RF conversion in FMC form factor
The FMC272 expands the VadaTech FPGA, data-acquisition and embedded computing portfolio with a high-speed RF conversion module compliant with VITA 57.1 FPGA Mezzanine Card specifications.
At its core is an Analog Devices AD9082, combining four digital-to-analog and two analog-to-digital converters. The four RF DACs operate at up to 12 GSPS with 16-bit resolution, while the two RF ADCs operate at up to 6 GSPS with 12-bit resolution.
This enables both RF signal generation and acquisition within a single compact FMC module connected directly to a compatible FPGA carrier.
Four 16-bit RF DACs at 12 GSPS
Each DAC supports sampling rates up to 12 GSPS at 16-bit resolution.
The DAC section provides 8 GHz usable analog bandwidth and supports Direct Digital Synthesis – DDS.
These capabilities target wideband RF signal-generation requirements including wireless communications, point-to-point microwave links, E-Band and 5G mmWave systems. They fit naturally within ECRIN Systems' Information & Communication Systems applications.
Dual 12-bit RF ADCs at 6 GSPS
Two 12-bit RF ADC channels operate at up to 6 GSPS.
The ADC section provides 8 GHz analog-input full-power bandwidth at -3 dB, enabling direct acquisition of wideband RF signals before digital processing in the carrier FPGA.
Target applications identified for the FMC272 also include phased-array radar and electronic warfare, making the module relevant to selected Defense, Aerospace & Security systems requiring high-speed RF acquisition and generation.
JESD204B/JESD204C interface to the host FPGA
Digital data is transferred to and from the host carrier through 8 JESD204B/JESD204C lanes.
For maximum-performance configurations, JESD204C operates at up to 24.75 Gbps.
The carrier therefore plays a central role in the final implementation, providing the FPGA transceivers and processing resources required to receive, generate and process these high-bandwidth data streams.
Flexible clock synchronization
The FMC272 supports an external synchronization clock through the front panel or a synchronization clock supplied by the FMC carrier.
An optional direct RF sampling clock input up to 12 GHz is also available.
Clocking options include 122.88 MHz VCXO PLL, direct RF input or 100 MHz VCXO PLL, allowing the clocking strategy to be adapted to the application.
Configurable RF front-end options
Available balun options include 500 kHz to 9 GHz Marki implementations with 1:2 or 1:1 ratios and an Anaren 400 MHz to 3 GHz option.
These balun frequency ranges are configuration options and remain distinct from the specified 8 GHz usable analog converter bandwidth.
Standard VITA 57.1 FMC integration
The FMC272 is compliant with ANSI/VITA 57.1 Standard FMC and measures 69 × 76.5 mm.
It is compatible with a broad range of Xilinx/AMD- and Altera/Intel-based FMC/FMC+ carrier platforms.
This modularity allows the RF front end and FPGA processing platform to be selected separately and combined according to the final system requirements.
For larger embedded systems, this approach fits directly within ECRIN Systems' COTS and Modified COTS integration model.
Commercial, industrial and extended-temperature configurations
Operating-temperature options include:
| Grade |
Operating temperature |
| Commercial |
-5°C to +55°C |
| Industrial |
-20°C to +70°C |
| Extended |
-40°C to +85°C* |
* Extended-temperature versions use conduction cooling with Humiseal 1A33 or 1B31 conformal coating and are subject to availability. Temperature is specified at the module edge.
Storage temperature is -40°C to +85°C, with 5–95% non-condensing humidity, 1 G operating vibration from 5 to 500 Hz, and 30 G operating shock on each axis.
From high-speed RF conversion to a complete FPGA processing chain
The FMC272 provides the RF conversion front end. Overall system capability also depends on the FPGA carrier, digital processing resources, clocking strategy, host interfaces, cooling and final embedded form factor.
ECRIN Systems can combine the FMC272 with a compatible FPGA carrier and integrate the complete signal-processing chain according to program requirements. Custom system definition and project support can address the FPGA platform, RF interfaces, synchronization and system-level constraints together.
For complete equipment, production and system integration can bring the FMC module, carrier and additional hardware into a complete embedded platform.
