Caelus - Air-cooled/Rugged Conduction-cooled VME board based on 16-core Intel® Core™ Ultra (Series 3) Processor

VME SBC board based on 16-core Intel® Core™ Ultra (Series 3) Processor See specifications

Caelus - VME SBC

16-core processor
64 Gbytes ECC LPDDR5 memory
Dual or single PMC/XMC sites for local expansion
Wide variety of I/O interfaces including SATA, USB, Ethernet, graphics and serial
Direct attached storage
BSP for Linux®, Windows® and VxWorks®
Option to exclude VMEbus
Available in air and conduction-cooled variants

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Description

Caelus is a high performance, flexible VMEbus board based on the 16-core Intel® Core Ultra (Series 3) Processor. It is designed for high security, long life-cycle applications using the latest operating systems.

Specifications

Interfaces

Serial Interfaces

2 x serial channel interfaces: 2 x RS232/422/485 accessed via P2
16550 compatible UARTs

Stereo Audio

Intel® High Definition Audio interface with CoDeC via optional P0:
- line level stereo input and output
- line level microphone input
- headphone output

Graphics Interfaces

1 x DVI-D interface or 2 x DVI-D interfaces via optional P0:
- up to 1920 x 1200 @ 16M colors
1 x VGA interface via P2:
- up to 1920 x 1200 @ 16M colors
- embedded DisplayPort to VGA converter
support for Microsoft® DirectX 12, OpenGL 4.5 under Windows® and Linux® and OpenCL 2.1

Other Peripheral Interfaces

PC Real Time Clock
watchdog timer; 32-bit Long Duration Timer with processor interrupt ability; chipset timer
1 x USB 2.0 via P2
up to 4 x USB ports accessed via optional P0:
- 1 x USB 2.0 port and 1 x USB 3.1 (Gen 1) port
- 2 x USB 2.0 ports (build option 1)
8 x GPIO signals via P2 plus 4 x GPIO signals
via optional P0:
- supports processor interrupt capability
Write Protect and External Reset via optional P0

Software

Flash EPROM

32 Mbytes of BIOS Flash EPROM, dual devices:
- main/backup device enabled via switch

BSP

support for Linux®, Windows® and VxWorks®

Board Security Packages

Trusted Platform Module (TPM 2.0)
option for Sanitization Utility Software Package
option for proprietary board-level security features

Firmware Support

UEFI 2.7 boot firmware (BIOS):
- implements Secure Boot
implements Intel® Boot Guard
optional Fast Boot solution using the Intel® Firmware Support Package (FSP)
LAN boot firmware included

Optional Built-In Test (BIT) Support

Power-on BIT (PBIT), Initiated BIT (IBIT), Continuous BIT (CBIT)

Safety

PCB

PCB (PWB) manufactured with flammability rating of UL94V-0

VME Interface

P1 and P2 connectors compatible with VME64x
implemented using IDT® Universe™ II device
VME Master/Slave
A32/A24/A16/D64/D32/D16/D8(EO)/MBLT
fast hardware byte swapping
auto system controller detect
full interrupter / interrupt handler support
bus error interrupt support
build option for busless VME interface:
- SYSRESET, SYSFAIL, ACFAIL,GAx
- VMEbus daisy chain

Processing Unit

Central Processor

16-Core H484 Core Ultra 7
includes 4 Xe3 integrated GPGPU
includes NPU 5.0 for AI acceleration

DRAM

64 Gbytes LPDDR5
- TBC MT/s
- dual channel architecture

XMC

XMC Sites

dual XMC interfaces
XMC I/O site 1:
XMC P16 rear I/O (X12d+X8d+X10s) via optional P0
- XMC I/O site 2:
XMC P26 rear I/O (X12d+X8d+X10s) via P2
- XMC PCI Express interfaces:
both support Gen 3 x4 PCI Express
both powered from 5V supply

Ethernet

Ethernet Interfaces

up to 3 x Gigabit Ethernet interfaces:
-implemented by an Intel® I350-AM4 LAN controller via a x2 PCI Express® port (Gen 2)
2 x Gigabit Ethernet interfaces via optional P0:
- utilizes VITA 31.1 (Gigabit Ethernet for VME64x backplanes)
1 x Gigabit Ethernet interface as a build option:
- via P0
- on-board magnetics (50V isolation via P0)

Mass Storage

Mass Storage Interfaces

up to 4 x external SATA300 interfaces:
- 2 x SATA via P2
- 2 x SATA via optional P0
1 x M.2 SSD site for optional on-board supporting:
-480GB to 3.82TB storage capacity with Opal 2.0 data at rest encryption
- 960GB FIPS 140-3 option
- Up to 960GB NCSC CAPS option
- x4 PCIe interface (M-key)
- NVM Express® (NVMe™) logical device interface
- NVMe 1.3 compatible
- M.2 can be fitted simultaneously with XMC modules

Electrical Specification

typical current figure for processor
64 Gbytes DRAM:
+5V @ TBD
+12V @ TBD; -12V @ TBD; 3.3V not required
+12V and -12V routed to both XMC sites

Environmental Specification

Air-cooled:

operating temperature:
-0°C to +55°C (N-Series)
extended operating temperatures based upon processor’s performance/power factory build option:
 -25°C to +70°C (E-Series)
 -40°C to +70°C (K-Series)
 -40°C to +85°C (K-Series)
non-operating temperature: -40°C to +85°C
5% to 95% Relative Humidity, non-condensing:
-K-Series includes humidity sealant

Conduction-cooled:

operating temperature (at card edge) based upon processor’s performance/power factory build option:
- VITA 47 Class CC4, -40°C to +85°C
- conduction-cooled
non-operating temperature:
- VITA 47 Class C4, -55°C to +105°C
operating altitude:
- -1,000 to 50,000 feet (-305 to 15,240 meters)
5% to 95% Relative Humidity, non-condensing

Mechanical Specification

Air-cooled:

6U form-factor
single slot, width 0.8-inch (20.3mm)
utilizes 160-way connectors for P1 and P2
optional P0 connector
IEEE 1101.10 VME64x handles, alternatively with option for VME32 handles
shock: 20g, 11ms, ½ sine
vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement

Conduction-cooled:

6U form-factor
single slot, width 0.8 inch (20.3mm)
utilizes 160-way connectors for P1 and P2
optional P0 connector
operating mechanical:
- shock - VITA 47 Class OS2, 40g
- random vibration - VITA 47 Class V3, 0.1g²/Hz