- NVIDIA Jetson AGX Orin Industrial
- Ampere GPU with 2048 CUDA Cores and 64 Tensor Cores
- 12-core Arm Cortex-A78AE CPU
- 64 GB LPDDR5 with up to 205 GB/s bandwidth
- 10GbE, PCIe Gen4, USB 3.2 and DisplayPort 1.4
The Condor AGX-IOX expands the EIZO Rugged Solutions portfolio offered by ECRIN Systems with a single-board computer combining CPU, GPU and dedicated AI acceleration resources.
It is based on the NVIDIA Jetson AGX Orin Industrial SoM, integrating a 12-core 64-bit Arm Cortex-A78AE CPU and an NVIDIA Ampere GPU featuring 2048 CUDA Cores and 64 Tensor Cores.
The platform provides 64 GB LPDDR5 on a 256-bit interface, with up to 205 GB/s shared memory bandwidth between the CPU, GPU and accelerator engines.
The board is designed for multi-sensor processing, edge data analysis, video encode/decode and AI inference within SWaP-constrained embedded systems.
For additional background on GPU technologies used in embedded computing platforms, see the ECRIN Systems guide on GPU selection for rugged PCs, servers and embedded computers.
In addition to the NVIDIA Ampere GPU, the Jetson AGX Orin platform provides two NVDLA v2 Deep Learning Accelerators and a PVA v2 Vision Accelerator.
This combination enables workloads to be distributed between the Arm CPU, GPU and dedicated acceleration engines within the same module.
These capabilities address data-intensive Defense, Aerospace & Security applications, including I/O-intensive C5ISR and AI-at-the-edge workloads identified for the AGX-IOX.
The Condor AGX-IOX provides a 10GbE Control Plane interface using 10GBASE-KR and a 1GbE Control Plane interface using 1GBASE-T.
Two PCIe Gen4 x4 connections are routed through the VPX connector: one to the Data Plane for legacy support and one to the Expansion Plane. They are mutually exclusive but can be combined into an x8 PCIe Gen4 connection according to the documented configuration.
The board can also interface with external PCIe DMA video capture cards.
This connectivity is particularly relevant to Information & Communication Systems combining multiple data sources, embedded processing and high-speed communications.
The board provides DisplayPort 1.4, USB 3.2, USB 2.0 and two RS-232 serial interfaces.
Internal storage is provided by 64 GB eMMC 5.1, with optional NVMe storage up to 2 TB.
These interfaces enable processing, communications and I/O resources to be combined within a compact single-slot 3U VPX platform.
The Jetson AGX Orin includes dedicated NVIDIA video engines.
NVENC supports encoding up to 2 × 4K60, while NVDEC supports decoding up to 3 × 4K60 or 1 × 8K30 according to the currently published specifications.
HEVC/H.265 and AVC/H.264 hardware encoding and decoding capabilities support applications combining video acquisition, AI processing and embedded analytics.
The Condor AGX-IOX is a 1.0-inch pitch, conduction-cooled 3U VPX board.
It supports SOSA® slot profile: SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and is designed to support VITA 46/65 and SOSA® technical-standard environments.
Dual IPMB IPMI provides Tier 1 and Tier 2 support together with multiple temperature and voltage sensors.
Published environmental specifications include:
These specifications are referenced to MIL-STD-810.
The Condor AGX-IOX can be integrated as the main compute building block within a wider VPX platform combining backplane, power, FPGA, networking, video acquisition and other I/O boards.
ECRIN Systems can integrate this technology through its COTS and Modified COTS approach, selecting and combining standard technology building blocks according to program requirements.
Project management can cover system definition, technology selection and validation phases.
Depending on project scope, ECRIN Systems can also provide production and system integration together with obsolescence management for long-term configuration control.
AI processing, multi-sensor systems, PCIe Gen4, 10GbE networking, video acquisition or environmental requirements: ECRIN Systems can support complete embedded system definition, from COTS technology selection through final integration.
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