Our long-time partner, Tews Technologies GmbH, is an active member of the working group focused on the development of the QMC-VITA93 standard. This collaboration highlights Tews' commitment to advancing technological innovation in the field of embedded electronics.
The QMC-VITA93 standard defines a Small Form Factor mezzanine that is significantly smaller than XMC, providing both host and I/O interface connectors. The host supports modern high-speed serial interfaces, ensuring high performance and flexibility. Multiple modules can be configured on different carrier card form factors, including 3U/6U VPX, cPCI, VME and VNX+, PCIe expansion cards, etc.
This standard is adaptable for deployment in both industrial, space or military environments.
Tews Technologies has also published an informative white paper that explores the features and benefits of QMC for the embedded electronics industry. The paper provides an in-depth analysis of how the QMC standard improves system performance and scalability.
Additionally, Tews is already working on developing a full range of QMC modules, ready to meet the growing needs of the market.
