An embedded computing system comprises a set of components that are sensitive to environmental stresses:
- Electronic boards;
- Processors;
- GPUs and FPGAs;
- Memory modules;
- SSDs;
- PCIe or VPX boards;
- Connectors;
- Power supplies;
- Heat sinks;
- Mounting systems;
- Internal cabling;
- External interfaces.
→ Repeated vibration, for example, can place stress on connectors, expansion boards and their mounting systems.
→ An impact can exert significant mechanical stress on heavy components.
→ A rise in temperature can reduce the thermal margins of processors or GPUs.
→ A drop in atmospheric pressure can affect the performance of cooling systems that rely on convection.
→ Salt spray, sand or dust can have a significant impact on systems installed directly in close proximity to the external environment.
Environmental qualification must therefore focus on the behaviour of the system as a whole.
Temperature: adapting the computer to its actual environment
ECRIN applications cover a wide range of environments.
Industrial rack-mounted servers and computers directly embedded in platforms therefore do not necessarily have the same operating ranges.
- The OPALE V2 Compact, a 2U rack-mounted server, is, for example, designed to operate from 0 to +50°C, in accordance with MIL-STD-810G methods 501.5 and 502.5.
- The µOPALE V2, in a 1U rack format, is designed for operation from 0 to +45°C, also in accordance with the relevant temperature methods of MIL-STD-810G.
For applications more directly exposed to the mission environment, the operating conditions become more severe.
- The OPALE-Rugged supports operation from -20 to +50°C and storage from -40 to +71°C (MIL-STD-810G 501.5 and 502.5).
- The ONYX, nanoONYX and µTOPAZE mission computers, on the other hand, support operating temperatures starting at -40°C.
This difference perfectly illustrates the MIL-STD-810 philosophy: qualification is tailored to the product’s intended use, rather than being applied as a generic standard identical across all platforms.
Shocks: protecting the integrity of the system and its components
Mechanical shocks may occur during:
- Transport;
- Handling;
- Installation;
- Vehicle movement;
- Certain phases of flight;
- Specific operational events.
For an electronic control unit, the risk is not limited to the chassis. Expansion cards, GPUs, storage media, connectors and various mechanical assemblies are also subject to stress.
The qualifications specify several levels tailored to the product families:
- The OPALE V2 Compact is specified to withstand an in-operation shock of 15 G for 11 ms across six axes, in accordance with MIL-STD-810G Method 516.6.
- The OPALE-Rugged achieves 30 G for 11 ms across six axes, again in accordance with Method 516.6 under its MIL-STD-810G qualification.
- The µTOPAZE VPX computer, meanwhile, is documented as having a shock level of 40 G for 11 ms.
These differences reflect distinct levels of integration and mission environments.
Vibration: a major constraint for aeronautical, land-based and naval platforms
In many embedded systems, vibration is a constant constraint.
It can originate from:
- The engine;
- The vehicle;
- Surrounding mechanical equipment;
- Aeronautical structures;
- Propulsion systems;
- Transport.
Unlike a one-off impact, vibration subjects the equipment to repetitive stress.
The system’s behaviour therefore depends, in particular, on:
- The rigidity of the chassis;
- The secure mounting of the circuit boards;
- The mass of the components;
- The mounting of PCIe cards, GPUs or other expansion cards;
- The connectors;
- The storage;
- The overall mechanical behaviour.
During operation, the OPALE-Rugged exhibits a vibration profile ranging from 5 to 2,000 Hz at 4 Grms and complies with MIL-STD-810G Method 514.6.
The high-performance myOPALE-RS server, capable of accommodating two dual-slot GPUs, is specified at 5 to 2,000 Hz / 2 Grms, also in accordance with Method 514.6.
On a system of this calibre, mechanical ruggedisation therefore does not simply concern the enclosure: it must also take into account the mounting of the GPUs, expansion cards, power supplies and storage.
Altitude and low pressure: a particular challenge for the aerospace industry
The qualification of aerospace equipment cannot be separated from its pressure environment. As altitude increases, the decrease in air density can notably affect heat transfer. This issue becomes particularly significant when processors, GPUs or power supplies dissipate several tens or hundreds of watts.
ECRIN systems cover several usage classes. The OPALE-Rugged is qualified for operation up to 5,000 m / 16,000 ft, with MIL-STD-810G Method 500.5 among the explicitly stated test methods.
For many microcontrollers intended for aerospace applications, the RTCA DO-160 specifications supplement MIL-STD-810. The nanoONYX family, for example, supports pressures of up to 116 mbar – corresponding to approximately 50,000 ft – with the DO-160 specification associated with this characteristic.
The µTOPAZE also has a pressure range of up to 116 mbar / 50,000 ft.
This coexistence of MIL-STD-810 and DO-160 is important in aerospace applications: the standards are complementary and must remain linked to the tests to which they actually relate.
Humidity, rain, dust and saline environments
Military environments are, of course, not limited to mechanical stresses. For a naval, land-based or vehicle-mounted system exposed to the external environment, exposure to humidity, water, sand or a saline environment can become a major design criterion.
OPALE-Rugged lists the following methods in its MIL-STD-810G qualification:
- 506.5 – Rain;
- 507.5 – Humidity.
The Quartz ruggedised Ethernet switch features a particularly extensive set of MIL-STD-810G methods: 500.5, 501.5, 502.5, 506.5, 507.5, 508.6, 509.5, 510.5, 513.6, 514.6 and 516.6.
These include, in particular, methods relating to:
- Low pressure;
- Temperatures;
- Rain;
- Humidity;
- Salt spray;
- Sand and dust;
- Vibrations;
- Shocks.
Quartz also has an IP67 protection rating and uses MIL-DTL-38999 connectors.
For naval, aeronautical or land-based platforms, this approach is essential: the robustness of the network must be consistent with that of the computers it interconnects.