A QMC FPGA module for application-specific I/O
The TQMC605 expands the TEWS Technologies embedded I/O portfolio with a QMC module based on a user-programmable AMD Artix 7 XC7A50T-2 FPGA.
Its VITA 93.0 single-width QMC form factor enables a reconfigurable FPGA resource to be integrated into compatible embedded systems. The host electrical interface is PCI Express Revision 2.1.
The TQMC605 is intended for applications where I/O functionality needs to be defined at FPGA level rather than relying exclusively on fixed-function interfaces.
40 I/O lines directly connected to the FPGA
The key feature of the TQMC605 is its 40 I/O lines connected directly to FPGA pins.
This direct connection preserves the flexibility of the AMD Artix 7 SelectIO™ technology, while each I/O line includes an external ESD protection device.
This is also the main distinction from the TQMC600. The TQMC600 offers variants with predefined TTL, EIA-422/EIA-485 or M-LVDS interfaces, whereas the TQMC605 provides 40 lines directly connected to the FPGA.
This flexibility can be used in embedded I/O systems for industrial applications and Defense, Aerospace & Security applications requiring FPGA-based I/O functions.
FPGA development with AMD Vivado™
The user FPGA is configured from a 128 Mbit SPI Flash.
FPGA development is supported by AMD Vivado™, while the QMC JTAG interface provides in-circuit debugging and real-time analysis using Vivado Integrated Logic Analyzer (ILA).
This provides a direct development path for implementing, loading and debugging application-specific FPGA logic on the module.
Software support for FPGA access
The TDRV020-SW driver family provides an application interface for supported reconfigurable FPGA boards.
Functions include 8-, 16- and 32-bit access to the programmed FPGA, board-resource allocation and handling of hardware-generated events and interrupts.
Software variants are available for Green Hills INTEGRITY, VxWorks, Windows, Linux and QNX Neutrino.
Air- and conduction-cooled variants
Two TQMC605 variants are planned:
- TQMC605-10R-A – air cooled;
- TQMC605-10R-H – conduction cooled.
Both versions support an operating temperature range from -40°C to +85°C and 5–95% non-condensing humidity.
Integrating the TQMC605 into a complete QMC platform
A QMC mezzanine requires a compatible carrier or host platform.
ECRIN Systems can integrate the TQMC605 within its COTS and Modified COTS approach, combining the FPGA module with the carrier board, host computer and other I/O resources required by the system.
TEWS carrier solutions include the TPCE210, which provides two QMC sites on a PCI Express carrier, and the TCPS210, which provides three QMC sites within a 3U CompactPCI Serial module.
ECRIN Systems can also provide project management and system definition together with production and system integration according to project scope.
