- 16 Arm Cortex-A72 cores up to 2.2 GHz
- 16 GB DDR4 ECC across two 64-bit memory banks
- 100GbE / 40GbE / 4 × 10GbE through QSFP28
- Rear GbE/10GbE, SRIO and PCIe connectivity
- Full-size AdvancedMC module with IPMI 2.0
The AMC705 expands the VadaTech embedded-computing portfolio with an Advanced Mezzanine Card processor module combining multicore Arm processing and high-speed network connectivity.
At its core is the NXP Layerscape LX2160A, providing 16 Arm Cortex-A72 cores running at up to 2.2 GHz with 8 MB of platform cache/on-chip memory.
The processor uses dual 64-bit memory controllers connected to 16 GB of ECC DDR4, arranged as two 64-bit memory banks.
Its single-module, full-size AMC form factor brings this processing capability into modular MicroTCA platforms.
The Layerscape LX2160A provides 16 Arm Cortex-A72 CPU cores, operating at up to 2.2 GHz, together with 8 MB of platform cache/on-chip memory.
The AMC705 provides 16 GB of DDR4 ECC memory across two 64-bit banks.
This combination provides multicore processing and error-correcting memory within a compact AMC module for systems combining computing and high-speed communications.
The AMC705 is therefore particularly relevant to Information & Communication Systems requiring modular processing and high-bandwidth network connectivity.
The front panel provides a QSFP28 interface supporting: 1 × 100GbE, 1 × 40GbE, or 4 × 10GbE.
A separate Gigabit Ethernet RJ-45 interface is also available.
The actual front-panel Ethernet mode is linked to the rear Ethernet configuration. If AMC Ports 0 and 1 operate at 10GbE, front-panel operation is limited to 40GbE.
To use 100GbE on the front panel, Ports 0 and 1 must operate at 1GbE.
This interaction between front and rear connectivity needs to be defined at system level when selecting the MicroTCA chassis and MCH.
AMC Ports 0 and 1 provide two Ethernet interfaces capable of 1GbE or 10GbE operation.
1GbE operation is covered by the normal AMC.2 implementation. 10GbE operation on Ports 0 and 1 is outside the AMC standard and requires either an MCH supporting 10GbE on these ports or a suitable point-to-point backplane connection.
The host platform therefore needs to be selected with the required rear Ethernet mode in mind.
AMC Ports 4 through 7 can be configured for SRIO or PCIe.
An additional PCIe option is available on Ports 8 through 11. Depending on the selected routing, the module can support configurations including dual PCIe x4 or a single PCIe x8 connection across Ports 4 through 11.
The SRIO interface supports SRIO 2.0.
This allows the processor module to be adapted to different MicroTCA backplane fabrics rather than imposing a single interconnect configuration.
The AMC705 provides 64 Gb of Flash memory and an SDHC socket in addition to its DDR4 ECC memory.
These resources can support local software, configuration data and application requirements depending on the final system implementation.
Linux is the standard operating-system option. Other operating systems require separate validation.
The AMC705 provides IPMI v2.0 module management for integration within AdvancedMC and MicroTCA environments.
It also incorporates a hot-swap ejector handle, IPMI management indicators and network Link/Activity LEDs.
Support for AMC.0, AMC.1, AMC.2 and AMC.4 brings together the mechanical, management and fabric interfaces needed for integration into an AMC-based system.
In addition to QSFP28 and Gigabit Ethernet RJ-45 connectivity, the front panel provides two RS-232 management interfaces through micro-USB connectors.
These interfaces support configuration and diagnostic access during system development and integration.
Published AMC705 power consumption is approximately 35 W.
Storage temperature is specified from -40°C to +85°C, with 5–95% non-condensing relative humidity.
Operating-temperature capability depends on the ordered environmental configuration rather than a single range applying to every AMC705 variant.
Published operating vibration is 1 G from 5 to 500 Hz on each axis.
The AMC705 needs to be selected together with the MicroTCA chassis, MCH and backplane fabric configuration.
The required combination of 100GbE, 40GbE, rear 10GbE, SRIO and PCIe directly determines what the rest of the platform must support.
For systems combining processor, FPGA, acquisition and communication modules, the AMC705 can form part of an ECRIN Systems COTS and Modified COTS solution, with the chassis, MCH and complementary boards selected according to the actual system data flows.
Production and system integration can then address the modules, backplane, cooling, network interfaces and final system configuration as a complete platform.
For long-life programs, obsolescence management can also be incorporated from the system-definition stage.
16 Arm Cortex-A72 cores, 16 GB DDR4 ECC, up to 100GbE on the front panel, rear Ethernet, SRIO and PCIe give the AMC705 extensive connectivity in a single AMC module. The real system performance, however, depends on what surrounds it.
The MCH, backplane routing, 1/10/40/100GbE distribution, SRIO or PCIe selection, cooling and complementary modules all need to be defined together.
ECRIN Systems can build the complete configuration around the AMC705, from MicroTCA chassis and MCH selection through processor, FPGA, networking and acquisition-module integration.
Already know your data flows, Ethernet configuration or PCIe/SRIO requirements? Send us your platform requirements and move directly to a coherent MicroTCA system study around the AMC705.